Morgan Hill, California -
May 28, 2003.
International, Inc. (OEA), the industry leader in 3D interconnect
extraction, and Enabling Solutions, Inc., a leading provider of high speed
interconnect (PCB, connector and package)
characterization and design solutions to system houses and the semiconductor
industries, today announced an agreement that will allow Enabling
Solutions to use OEA's state-of-the-art 2D and 3D
interconnect simulation tools into its system level characterization
services. In return, Enabling Solutions will provide critical feedback and
product development guidance to enable OEA to better serve the systems
demand for high performance and ever smaller devices has made semiconductor
packaging and interconnect design a vital contributor to system performance.
As integrated circuits have become faster and more complex, the cost and
performance of interconnects between chip and system board and between chip
to chip on system boards has become both a significant challenge and an
enabling technology. Enabling Solutions expertise in high speed electrical
characterization and design incorporated with OEA's characterizations tools
will offer a complete, accurate, high frequency interconnect solution," said
Manoj Nachnani, president of Enabling Solutions. "This characterization
solution jointly developed, will address the growing need for efficient
interconnect models for the densely routed packages and boards to better
predict performance in the design of PCBs, MCMs, and IC packages used in
leading-edge digital and analog designs."
offers very fast and accurate 2D and 3D inductance simulators for
calculating electrical parasitics of complex interconnect structures
including package leads, bond wires, connectors, power and ground planes.
Our package characterization tools are designed to develop detailed models
quickly and efficiently for understanding, analyzing, and optimizing
interconnect delay and crosstalk, and their effects in IC, PCB, Hybrid, MCM,
and package modeling applications," said Jerry Tallinger, vice president of
marketing and sales at OEA International. "Problems such as simultaneous
switching noise and ground bounce in packaging can easily be modeled and
solved. Careful consideration of the electrical characteristics of a package
will enhance an integrated circuit's handling of complex high speed
the Enabling Solutions/OEA Agreement
Solutions and OEA have partnered together to provide tools and methodologies
for characterizing and analyzing large number of I/Os efficiently. Also, the
companies have entered into a marketing and reselling agreement by which
Enabling Solutions will market a number of OEA products through its
Enabling Solutions, Inc.
Enabling Solutions, Inc. has been in the business of
providing services to system houses and the semiconductor industries for the
last seven years. It was incorporated on May 21st 1996 in the State of
California and is a privately funded corporation. The company is currently
focused on providing services in the areas of interconnect Characterization,
System level Signal Integrity Analysis, high speed package substrate and
system board designs.
For additional information call (408) 573-1325, or visit Enabling Solutions
OEA International, Inc.
International, Inc. designs and licenses state-of-the art parasitic
extraction software for the electronic computer aided design (ECAD)
industry. OEA software is designed to be extremely high performance and
handle very complex models with a high degree of accuracy. OEA products are
used to substantially increase engineering productivity and first time
success in the design of interconnect and packaging technologies for
sophisticated electronic systems and integrated circuits.
The company has secured the extraction accuracy leadership role by working
closely with major IC and system companies using the most modern process
technologies available. Through these relationships, the company has
applied it 3D extraction expertise to provide a family of critical net
design tools, signal integrity analysis tools, and RF component design
tools. For additional information call (408) 778-6747, or visit OEA online