Deployment of Extraction Module in AWR Products Dramatically Improves
Modeling Accuracy & Speeds Time to Market
EL SEGUNDO and MORGAN HILL,
Calif. - May 13, 2003 - Applied Wave Research Inc. (AWRTM), a
leading provider of high-frequency electronic design automation (EDA) tools,
and OEA International, Inc. (OEA), the industry leader in 3D interconnect
extraction, today announced a technology licensing agreement that enables
AWR to integrate into its high-frequency EDA design environment the core
interconnect extraction technology, including the
fast proprietary "Cheetah"
solver, from OEA's NET-ANTM
3D critical multi-net field extractor.
The companies also announced a marketing agreement enabling AWR to market a
number of OEA products through its worldwide distribution channels.
The integrated product
provides analog and radio frequency integrated circuit (RFIC) designers with
a new level of interactivity and ease-of-use through AWR's unified RF design
environment, while enabling full access to all the features and capabilities
of OEA's industry standard extraction technology. The combined solution will
provide the highest level of accuracy and performance for large-scale RFICs,
and thus maximizing designers' productivity and speeding up the product
development cycle time for wireless and wireline communications products.
analog and RFIC designs move up the performance scale and use more advanced
deep sub-micron technologies, the need for extremely accurate extraction
increases," said Ersed Akcasu, president and CEO of OEA. "The power behind
this tool comes from OEA's proprietary Cheetah 3D field solver that is the
EDA industry's only seamless full-field solver for full chip net
applications. Integration with AWR's industry-leading RF design environment
will give AWR customers designing wireless IC products access to the most
accurate interconnect extraction technology available in the industry."
integration of OEA's unique interconnect extraction technology into AWR's
unified RF design flow enables analog and RFIC designers to accurately
extract, simulate and analyze high-frequency effects on the interconnects
while creating the physical layout. This will eliminate the time-consuming
and error-prone sequential design steps and reworks that currently exist in
today's RFIC design flows," said James Spoto, president and CEO of AWR.
"This tightly integrated solution delivers an unprecedented level of
accuracy and performance in RFIC design that significantly increases
designer productivity and speeds time to market."
About the AWR/OEA Technology
AWR's unified RF data model
provides a comprehensive set of interconnect models spanning from ideal
short circuit, to lumped element, to transmission line model, and to full 3D
electromagnetic (EM) model. The incorporation of OEA's Cheetah 3D field
solver extraction technology extends the range of interconnect modeling to
include extraction of distributed
inductance and mutual inductance (RCLK) models directly from physical layout, enabling
full flexibility in accuracy and performance trade-off in RF interconnect
analysis. The Cheetah extraction program, the core technology in OEA's
NET-ANTM product, is the only true seamless 3D critical multi-net
field extractor that takes into account the full 3D nature of the problem,
providing accurate simulation of even the largest and most complex nets. An
embedded version of the OEA Cheetah solver technology will be integrated
into AWR's design flow and will be available in the second half of 2003.
About the AWR/OEA Marketing
AWR and OEA also entered into
a marketing and reselling agreement by which AWR will market a number of OEA
products through its worldwide distribution channels. The list of products
- a multi-net 3D IC net extraction tool providing the capability to
extract the same RCLK data for a larger scale and within a system of
- a RF passive component synthesis tool enabling the simulation of RF
passive components for frequency-dependent RCLK and producing an N-Port
- a substrate modeling tool for creating a simplified model of the
substrate resistance network.
- a 2D/3D parasitic extraction package for general purpose package
and printed circuit board (PCB) transmission-line model extraction to a
SPICE or matrix format.
About OEA International,
OEA International, Inc.
designs and licenses state-of-the art parasitic extraction software for the
electronic computer aided design (ECAD) industry. OEA software is designed
to be extremely high performance and handle very complex models with a high
degree of accuracy. OEA products are used to substantially increase
engineering productivity and first time success in the design of
interconnect and packaging technologies for sophisticated electronic systems
and integrated circuits.
The company has secured the extraction accuracy leadership role by working
closely with major IC and system companies using the most modern process
technologies available. Through these relationships, the company has
applied it 3D extraction expertise to provide a family of critical net
design tools, signal integrity analysis tools, and RF component design
tools. For additional information call (408) 778-6747, or visit OEA online
About Applied Wave
Applied Wave Research was
founded in 1994 and is a leading supplier of high-frequency electronic
design automation (EDA) products for the design of wireless
telecommunications equipment, semiconductors, high-speed computers,
networking systems, and a variety of other electronics-based products. AWR
is a privately held company and has development offices, sales offices,
training centers, and global distribution. AWR has over 400 customer
companies worldwide, including virtually every major high-frequency
electronic component and system supplier. AWR partners with other leading
EDA companies, such as Cadence Design Systems, Inc. (NYSE:CDN),
to ensure interoperability in all existing design flows. The company is
located at 1960 East Grand Avenue, Suite 430, El Segundo, California 90245.
For more information about AWR and its products, please visit
www.mwoffice.com or call 310-726-3000.
AWR, the AWR logo, Microwave Office, and EM
Socket are trademarks of Applied Wave Research, Inc. OEA, the OEA logo,
NET-AN, Cheetah are trademarks of OEA International, Inc. All other marks
are the property of their respective holders.
For more information, please
Applied Wave Research, Inc.
1960 East Grand Avenue, Ste. 430, El Segundo, CA
Tel 310-726-3000 - Fax 310-726-3005
Vantulden - For Applied Wave Research, Inc.
Bluestone PR, Inc.
Jerry Tallinger, VP of Marketing and Sales
OEA International, Inc.
155 East Main Avenue, Ste. 110, Morgan
Hill, CA 95037
Tel 408-7786747 - Fax 408-7786748