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OEA International Announces the First Frequency Dependent Inductance Solver for Packages
Morgan Hill, CA - April 29, 2002 -
OEA today announced HENRY™ 2.0, an
inductance extraction tool for the calculation of package parasitic
inductance, resistance, and mutual inductance.
New features are: frequency dependent inductance and resistance and
a new graphical interface. “With
chip IO speeds increasing dramatically, accurate frequency dependent
parasitics are critical for determining if a chip will function
properly.” said Ersed Akcasu, President of OEA International, Inc.
Applications include bond wires, package leads, and package ground
HENRY was rewritten to
include an advanced partial equivalent element calculation that was
modified to include frequency dependent skin effects.
HENRY includes three solvers, one for structures in which the
current flow is defined by the structure, such as bond wires and package
leads; a second solver is for power and ground planes where the current
flow is determined by the positions of the pins and vias; and a third
solver for reduction of inductively coupled Spice networks to an
equivalent inductance and resistance.
Many bundled utilities help automatically create complex shapes
such as bond wires and tab lead frames.
was first announced in 1991, and was the first inductance extraction tool
available on the market.
OEA’s HENRY tool
is available immediately starting at $18,000.
OEA International, Inc., is the industry leader in 3D extraction of interconnects. OEA’s tools are currently used in the most demanding extraction and design environments. Some of the world’s most advanced design facilities use OEA tools for detailed analysis and design of high-speed clocks, buses, I/O rings, and power grids. For additional information call (408) 778-6747, or visit OEA online at www.oea.com
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